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DSP Group to Participate in Rodman & Renshaw Annual Global Investment Conference

SAN JOSE, Calif., Aug 29, 2011 (GlobeNewswire via COMTEX) --

DSP Group(R), Inc. (Nasdaq:DSPG), a leading global provider of wireless chipset solutions for converged communications at home, will be participating in the Rodman & Renshaw Annual Global Investment Conference at New York's Waldorf Astoria Hotel on September 11-13, 2011.

DSP Group's CFO, Dror Levy and Director of Investor Relations, Victor Halpert will be making a company presentation on September 13 at 10:25-10:50 a.m. in the New Amsterdam Suite. Investors will have the opportunity to hold one-on-one meetings with DSP Group management during the conference. Those interested should contact either conference organizers or DSP Group's Investor Relations team.

About DSP Group

DSP Group, Inc. (Nasdaq:DSPG) is a leading global provider of wireless chipset solutions for converged communications at home. Delivering system solutions that combine semiconductors and software with reference designs, DSP Group enables consumer electronics (CE) manufacturers to cost-effectively develop new revenue-generating applications with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, and with a growing share of the wireless home telephony market, DSP Group provides a broad portfolio of wireless chipsets integrating DECT, Wi-Fi, PSTN and VoIP technologies with state-of-the-art application processors. Enabling converged voice, audio, video and data connectivity across diverse consumer products -- from cordless and VoIP phones to home gateways and connected multimedia screens -- DSP Group proactively partners with CE manufacturers to shape the future of converged communications at home. For more information, visit

The DSP Group, Inc. logo is available at

This news release was distributed by GlobeNewswire,

SOURCE: DSP Group, Inc.

CONTACT: Victor Halpert
Director of Investor Relations