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DSP Group Announces Revolutionary DBM11 Noise-Elimination SOC for Mobile Devices

SAN JOSE, Calif., June 14, 2012 (GLOBE NEWSWIRE) -- DSP Group®, Inc. (Nasdaq:DSPG), a leading global provider of wireless chipset solutions for converged communications, announced today the release of its cutting-edge DBM11 noise-elimination System-On-a-Chip (SOC) for headsets and mobile devices. Powered by HDClearTM technology, DBM11 introduces unparalleled voice quality and call intelligibility by eliminating ambient noise and delivers a noise-free conversation experience that boosts call clarity and enhances productivity.

DBM11 integrates HDClear, a suite of innovative speech-processing and noise-cancellation algorithms. A small-footprint, low-power SOC that can be integrated easily into small Bluetooth headsets and other mobile devices, DBM11 has already been designed-in by several device makers worldwide, and products incorporating its unique capabilities are expected to launch in the first quarter of 2013.

DBM11 delivers remarkable performance in highly noisy environments. In cases of a signal-to-noise ratio (SNR) of 10dB, DBM11 delivers approximately 25dB better performance when compared to the most advanced headsets and mobile devices available today.

DBM11 achieves even more extraordinary results with speech recognition. With current devices, speech recognition accuracy drops from over 95% in quiet environments to less than 30% in noisy environments; leveraging HDClear technology, DBM11 ensures that accuracy in noisy environments remains well above 75%.

"DBM11 brings unparalleled noise elimination to the mobile market with superior voice enhancement and call intelligibility capabilities unmatched elsewhere in the marketplace. This state-of-the-art technology brings together our excellence in voice processing and innovative technologies acquired from BoneTone Communications," said Ofer Elyakim, Chief Executive Officer of DSP Group. "DSP Group once again is setting the performance standard for speech-processing technologies. We are very excited about our current design activity, and gratified by the overwhelmingly positive feedback received from our customers."

About DSP Group

DSP Group, Inc. (Nasdaq:DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio of wireless chipsets integrating DECT/CAT-iq, DECT ULE, Wi-Fi, PSTN, BoneTone™ intelligent voice enhancement and noise elimination, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse consumer and business products – from connected multimedia screens, mobile devices, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers to shape the future of converged communications at home, office and on the go. For more information, visit www.dspg.com.

The DSP Group, Inc. logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=6171

CONTACT: For more information, please contact:
         Orly Garini-Dil
         Marketing Communications Manager
         DSP Group Inc.
         Phone: +972 54 5225382
         orly.garini@dspg.com

Image: DSP Group

DSP Group, Inc.