--Platform shortens time-to-market and reduces engineering/design costs
IRVINE, CA, July 27, 2001 - Intersil Corporation (NASDAQ: ISIL), a leading provider of silicon technology for wireless access and communications analog markets, announced today that it will combine its subscriber line interface circuits (SLICs) with digital signal processors (DSPs) from VoicePump, Inc., a wholly owned subsidiary of DSP Group, Inc. (NASDAQ: DSPG), for a new four-channel, voice-over-packet (VoP) development platform and reference design.
The reference design will combine the space- and power-savings of four Intersil micro-lead-frame (MLF) HC55185 ringing SLICs with the flexibility of VoicePump's programmable four-channel VP140 mixed-signal DSP. The VP140 is a member of VoicePump's VP100 family and is designed to integrate DSP Group's TeakLite™ DSP core with most of the circuitry needed to accommodate four packet-voice channels in a single processor.
"The HC55185 offers a combination of advantages that continues to attract a wide customer base," said Rick Furtney, vice president and general manager of Intersil's Analog Business Unit. "Key features singularly found in SLICs of other suppliers all exist in our popular HC55185. Nowhere else can converged voice/data systems manufacturers find the right combination of space-savings, power-savings, feature-richness, cost-competitiveness and total support."
Intersil and VoicePump anticipate that their joint development platform will provide customers with a complete turnkey solution that shortens time-to-market and greatly reduces engineering/design costs for VoP Integrated Access Devices (IADs) identified with voice over digital subscriber line (VoDSL), voice over Internet protocol (VoIP), or voice over broadband (VoB) technologies in general.
"When used together in the same design, Intersil's ringing SLICs and VoicePump's VP140 digital signal processors can provide manufacturers of low-to-medium-density voice gateways and integrated access devices with a cost-effective, short time-to-market system," said Didier Boivin, chief executive officer at VoicePump.
Intersil's HC55185 Ringing SLIC
The HC55185 is one of the newest members of Intersil's RSLIC18™ family and is a full-featured ringing SLIC (URL:http://www.intersil.com/design/VoIP/index.asp). This small 7 X 7 mm MLF version is specifically designed for high-density integration required by many integrated-access applications. The HC55185's features include onboard ring generation, low power consumption, programmable transient current limiting, integrated MTU DC characteristics, silent polarity reversal, pulse metering, on-hook transmission, tip-open ground-start operation, balanced and unbalanced ringing, thermal shutdown with alarm indicator and one of the lowest external parts counts in the industry.
The VoicePump VP100 Family
VoicePump's VP100 series integrates DSP Group's TeakLite programmable DSP core with program/data memory, host processor interface, analog front end, analog-to-digital and digital-to-analog converters. The VP100 family is also designed to integrate the necessary DSP firmware to perform all voiceband processing functions, including speech compression and decompression, echo cancellation and associated telephony signaling functions.
About VoicePump, Inc.
VoicePump, Inc., develops integrated silicon solutions for VoIP, VoDSL and other voice-over-packet applications that incorporate DSP Group's DSP cores and mixed-signal technology. VoicePump's products embed optimized, field-proven speech coding and telecom algorithms developed during its seven years as a DSP software company. VoicePump was founded in 1993 and became a wholly owned subsidiary of DSP Group, Inc. in 2001. The company is headquartered in Santa Clara, CA and has offices in Schaumburg, IL and Israel. More information is available on the Web at www.voicepump.com.
About DSP Group, Inc.
DSP Group, Inc., is a global leader in the development and marketing of high-performance, cost-effective, licensable digital signal processing (DSP) cores. The company's family of DSP cores provides ideal solutions for low-power, cost-effective applications such as cellular, broadband communications, VoIP, multimedia, advanced telecommunications systems, disk-drive controllers, and many other controller applications. By combining its DSP core technologies with its proprietary, advanced speech-processing algorithms, DSP Group also delivers a wide range of enabling, application-specific integrated circuits (ICs) for full-featured, integrated-telephony products and applications, including 900 megahertz and 2.4 gigahertz wireless technologies. DSP Group maintains an international presence with offices located around the globe. More information about DSP Group is available from its Web site at www.dspg.com.
Intersil is a leading supplier of semiconductors, reference designs and software for wireless access and communications analog markets. Intersil applies analog, mixed-signal and radio frequency (RF) expertise to products that enable wireless access to broadband media; provide reliable power management for PCs, files servers and portable information appliances; and convert analog and digital signals in cellular and Internet infrastructure. For more information about Intersil, visit the company's Internet homepage at www.intersil.com.
This press release contains information that constitute forward-looking statements as defined in Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Such forward-looking statements are based upon management's current expectations, estimates, beliefs, assumptions, and projections about our business and industry. Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will" and variations of these words or similar expressions are intended to identify forward looking statements. In addition, any statements that refer to expectations, projections or other characterizations of future events or circumstances, including any underlying assumptions, are forward looking statements. These forward-looking statements are not guarantees of future performance and are subject to certain risks, uncertainties and assumptions that are difficult to predict. Therefore, our actual results could differ materially and adversely from those expressed in any forward-looking statements as a result of various risk factors. Important risk factors that may cause such material differences for Intersil in connection with Intersil Corporation's ("Intersil's") communications/IC products include, but are not limited to: the rate at which our present and future customers and end-users adopt Intersil's current, and next-generation communications IC products and technology; the timing, rescheduling or cancellation of significant customer orders; the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; silicon wafer pricing and the availability of foundry and assembly capacity and raw materials; intellectual property disputes; as well as other risk factors detailed from time to time in Intersil's filings with the U.S. Securities & Exchange Commission, which you may obtain for free at the SEC's Web site at www.sec.gov These forward-looking statements are made only as of the date of this press release and Intersil undertakes no obligation to update or revise these forward-looking statements.
RSLIC18 is a trademark of Intersil Americas Inc.
TeakLite is a trademark of DSP Group, Inc.