Press Release Details

DSP Group Releases Groundbreaking XpandR III Wireless Multimedia Chip

May 31, 2011
Comprehensive SoC Solution Represents a New Era in Home Connected Multimedia Terminals and Telephony

SAN JOSE, Calif., May 31, 2011 (GlobeNewswire via COMTEX) --

DSP Group(TM), Inc. (Nasdaq:DSPG), a leading global provider of wireless chipset solutions for converged communications at home, announced today the release and availability of XpandR(TM) III, the next generation in the company's XpandR family of multimedia chipset solutions. The world's only system on a chip (SoC) integrating Wi-Fi and DECT, the cutting-edge XpandR III supports voice, video, audio and data on an advanced low-power system, making it the optimal enabler of cost-efficient telephony, VoIP, video communications, and multimedia applications. The comprehensive, highly integrated solution is offered with a complete hardware and software development kit. XpandR III reduces system bill of materials (BOM), development efforts, and time to market for tablet/media phones, video phones, high-end IP phones, Wi-Fi handsets, home control and surveillance and other connected multimedia, voice and video terminals.

Operated by a powerful 1GHz ARM Cortex(TM)-A8 application processor and 300MHz ARM9(TM) co-processor, the high-performance 1.3GHz processing power XpandR III enables value-added applications as well as voice and data connectivity to enhance the user experience. A complete hardware and software solution, all-in-one, XpandR III includes diverse semiconductors SoC, Wi-Fi and DECT module development boards, form-factor reference designs, embedded software packages and an Android-based software development kit (SDK) with reference applications.

"The market for affordable, easy-to-use devices that harness the power of multimedia in the home environment has great potential, and is just getting started," said Oz Zimerman, Corporate VP of Marketing and Business Development at DSP Group. "By combining a powerful dual-core system on a chip with both Wi-Fi and DECT, XpandR III represents a new era in home connected multimedia terminals and telephony."

The XpandR III SoC features advanced multimedia hardware engines with a high-definition (HD) 1080p multi-format video decoder supporting Google WebM (VP8), and an HD multi-format video encoder enabling full-duplex HD videoconferencing and video recording. Built with a 2D/3D graphics engine supporting Open GL ES 1.1/2.0 and a dedicated security processor for secure boot/storage and DRM, XpandR III offers Wi-Fi, Wi-Fi Direct and DECT/CAT-iq embedded connectivity.

"The latest in our line of advanced chipset solutions, XpandR III brings together voice, video, audio and data to open the door to innovative applications such as visual telephony, multimedia streaming, media-content sharing, and home control and monitoring," Zimerman said. "Providing CE manufacturers with a highly integrated, single-vendor, cost-optimized solution, XpandR III not only promotes mass market adoption, but also ensures fast time to market."

Targeting both portable and stationary products, the complete XpandR III solution is now available for original design manufacturers (ODMs) and original equipment manufacturers (OEMs) interested in launching new project development.

DSP Group will be demonstrating XpandR III at COMPUTEX TAIPEI from May 31 to June 4. Demonstrations will be offered in Room 203B (Hall 4) of the Taipei International Convention Center (TICC).

About DSP Group

DSP Group, Inc. (Nasdaq:DSPG) is a leading global provider of wireless chipset solutions for converged communications at home. Delivering system solutions that combine semiconductors and software with reference designs, DSP Group enables consumer electronics (CE) manufacturers to cost-effectively develop new revenue-generating applications with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, and with a growing share of the wireless home telephony market, DSP Group provides a broad portfolio of wireless chipsets integrating DECT, Wi-Fi, PSTN and VoIP technologies with state-of-the-art application processors. Enabling converged voice, audio, video and data connectivity across diverse consumer products -- from cordless and VoIP phones to home gateways and connected multimedia screens -- DSP Group proactively partners with CE manufacturers to shape the future of converged communications at home. For more information, visit

The DSP Group, Inc. logo is available at

This news release was distributed by GlobeNewswire,

SOURCE: DSP Group, Inc.

CONTACT: Orly Garini-Dil
DSP Group, Inc.
Tel: +1-408-240-6839
Monica Maron
Spicetree Communications
Mobile: +972-54-5429529