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DSP Group to Participate at Cowen 2020 Virtual TMT Conference

SAN JOSE, Calif., May 13, 2020 (GLOBE NEWSWIRE) -- DSP Group®, Inc. (Nasdaq:DSPG), a leading global provider of wireless chipset solutions for converged communications, announced today that it will be participating in the Cowen 2020 Virtual TMT Conference on May 26th 2020. DSP Group’s management is scheduled to present on May 26th at 09:10am.

Investors will have the opportunity to hold virtual one-on-one meetings with DSP Group management during this conference. Those interested should contact DSP Group's Investor Relations team at ir@dspg.com.

A webcast of the conference presentation will be available in the investor relations section of the company’s website at http://ir.dspg.com.

About DSP Group
DSP Group®, Inc. (NASDAQ: DSPG) is a global leader in wireless chipsets for a wide range of smart-enabled devices. The company was founded in 1987 on the principles of experience, insight and continuous advancement which enable the company to consistently deliver next-generation solutions in the areas of voice, audio, video and data connectivity. Experts in voice processing, DSP Group invests heavily in innovation for the smart future, the result is leading-edge semiconductor technology that is enabling our customers to develop a new wave of products that bring enhanced user experiences through innovation, like conversation technology. From mobile phones to VoIP and virtual assistants using cloud-based voice services, DSP Group is the answer to the growing demand for the ever-expanding collection of voice controlled smart devices. For more information, visit www.dspg.com.

Contact:
Tali Chen, Chief Marketing Officer, tel: 1-669-286-9181, tali.chen@dspg.com

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Source: DSP Group, Inc.