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DSP Group Announces Appointment of Daniel Amir to Corporate Vice President, Business Development, Strategy and Investor Relations

LOS ALTOS, Calif., May 24, 2016 (GLOBE NEWSWIRE) -- DSP Group®, Inc. (NASDAQ:DSPG), a leading global provider of wireless chipset solutions for converged communications, announced today the appointment of Daniel Amir as its new corporate vice president, business development, strategy and investor relations with immediate effect.

Daniel will contribute to DSP Group’s overall strategy and oversee business development and investor relations activities and will be based in the Bay Area.

Daniel is a veteran of the financial industry with a successful equity research career that spans over 16 years covering the semiconductor and hardware sector. Before joining DSP Group, Daniel was a Managing Director at Ladenburg Thalmann, where he headed the equity research team covering semiconductor and hardware stocks. He previously headed the semiconductor research practices at Lazard Capital Markets and WRHambrecht. Daniel is a graduate of UCLA Anderson School of Management with an MBA in Finance.

"Daniel is a valuable addition to our management team who brings a deep understanding of our company and industry. His Silicon Valley presence, knowledge of and familiarity with our markets, business and capital markets are invaluable as we seek to expand and strengthen our presence globally," said Ofer Elyakim, CEO of DSP Group.

"I’m thrilled to join the DSP Group management team who I’ve known for nearly 12 years,” said Daniel Amir, “DSP Group is distinguished by an excellent management team, an entrepreneurial culture and a diversified product portfolio that is positioned for growth. The company has a long record of innovation and is currently at an inflection point with new products ramping into new markets. I look forward to helping to develop the business further and communicate the DSP Group story to the street.”

About DSP Group

DSP Group®, Inc. (NASDAQ:DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and hardware reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio of wireless chipsets integrating DECT/CAT-iq, ULE, Wi-Fi, PSTN, HDClear™, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products – from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers to shape the future of converged communications at home, office and on the go. For more information, visit

Dror Levy, Chief Financial Officer
Tel: +972-9-952-9699

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